Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.

以环氧树脂,间苯二胺和二氨二苯甲烷低融点混合物固化剂,铜粉填料,制备了热固化各向同性胶。