CMP levels off the top layers of the wafer and is typically used as the last step in a cycle of processes in order to prepare the wafer for another layer to be added.

械平面使顶层变得平整，通常作为一系列工艺循环中最后一步，以准备在上添加另一层。

Before the next level of copper lines are added, this one's uneven lines must be polished flat, to near-atomic precision, using a sophisticated grinding process called chemical mechanical polishing, or CMP.

在添加下一层铜线之前，必须使用一种称为械抛光（CMP）高级研磨工艺，将当前一层不平整线条打磨至接近原子级平滑度。

We pulled blood work, and we pulled these basic biomarkers, CBC, CMP, lipid panel, hormone panel, and nutrient deficiencies.

我们进行了血液检查，提取了些基本生物标志物：全血细胞计数（CBC）、综合代谢面板（CMP）、脂质谱、激素谱以及营养缺乏情况。

CMP applies slurry and uses abrasive pads to grind and polish away the top surface of the wafer, making it perfectly flat.

械平面使用浆液和研磨垫打磨并抛光片表面，使其完全平坦。

CMP uses a controlled slurry of sub-micron ceramic particles to gently scrape and flatten the bumpy features.

械抛光（CMP）利用含有亚微米级陶瓷颗粒受控悬浮液，轻柔地刮擦并平整那些凹凸不平表面。

The second method to remove material is CMP, which is Chemical Mechanical Planarization.

第二种去除材料方法是械平面，简称CMP。

Meanwhile, CMP slurries are continually flushed with water to keep their fine particles from forming chunks that would tear apart the fragile copper lines.

同时，CMP浆料会不断用水冲洗，以防止其细小颗粒聚集成块，从而撕裂脆弱铜线。