Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.

以环氧树脂为体,间苯胺和苯甲烷低融点为固化剂,铜粉为导电填料,制备了热固化各向同性导电胶。