1.The relative displacement between the front and retral loading location is emphasized.

1.着重研究了前加载点相对位移。

2.Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

2.最用正交试方法对肖特基器件部封装中工艺进行了参数优化设计。