The relative displacement between the front and retral loading location is emphasized.

着重研究了前后油缸加载点的相对。

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

后用正交试的方法对肖件后部封装中的压焊工艺进行了参数优化设计。