The invention relates to thermocuring isotropic conductive adhesive and a preparation method thereof.

本发明涉及种热固化各向同导电胶及其制备方法。

Macroscopic deviations from isotropy occur due to bedding, schistosity and also sometimes fracturing.

与各向同很大的情况往往产生于层理，片理，某些候则由于断裂所造成。

It leads to one simple equation, which, in the isotropic case, is the bipotential equation .

因为它可以推出单的方程，在各向同的情况下，这单方程是双位势方程。

Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.

以环氧树脂为基体,间苯二胺和二氨基二苯甲烷的低融点混合物为固化剂,铜粉为导电填料,制备了热固化各向同导电胶。