CMP levels off the top layers of the wafer and is typically used as the last step in a cycle of processes in order to prepare the wafer for another layer to be added.

化学机械面化使晶圆顶层变得，通常作为一系列循环中最后一步，以准备在晶圆上添加另一层。

Before the next level of copper lines are added, this one's uneven lines must be polished flat, to near-atomic precision, using a sophisticated grinding process called chemical mechanical polishing, or CMP.

在添加下一层铜线之前，必须使用一种称为化学机械抛光（CMP）高级研，将当前一层不线条打至接近原子级滑度。

We pulled blood work, and we pulled these basic biomarkers, CBC, CMP, lipid panel, hormone panel, and nutrient deficiencies.

我们进行了血液检查，提取了些基本生物标志物：全血细胞计数（CBC）、综合代谢面板（CMP）、脂质谱、激素谱以及营养缺乏情况。

CMP applies slurry and uses abrasive pads to grind and polish away the top surface of the wafer, making it perfectly flat.

化学机械面化使用浆液和研垫打并抛光晶片表面，使其完全坦。

CMP uses a controlled slurry of sub-micron ceramic particles to gently scrape and flatten the bumpy features.

化学机械抛光（CMP）利用含有亚微米级陶瓷颗粒受控悬浮液，轻柔地刮擦并那些凹凸不表面。

The second method to remove material is CMP, which is Chemical Mechanical Planarization.

第二种去除材料方法是化学机械面化，简称CMP。

Meanwhile, CMP slurries are continually flushed with water to keep their fine particles from forming chunks that would tear apart the fragile copper lines.

同时，CMP浆料会不断用水冲洗，以防止其细小颗粒聚集成块，从而撕裂脆弱铜线。