Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试法对肖特基器件后部封装中压焊工艺进行了参数化设计。

The diode intrinsic noise temperature of some milimeter Schottky mixer diode was measured and reviewed. A measurement method was described at room and cooled temperature.

本文对一些毫米波肖特基势混频二极管本征度进行了测试和分析。介绍了在常和致冷下混频二极管本征测试法。