Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.

以环氧基体,间苯二胺和二氨基二苯甲烷低融点混合物固化剂,铜粉导,制备了热固化各向同性导胶。