Note that the oxide layer under the photoresist is protected.

请注意，光刻胶下方氧化层受到保护。

To clean up, we use yet another special chemical that washes away any remaining photoresist.

为了清理，我们使用了另一种特殊化学洗掉所有残留光刻胶。

Where the mask blocks the light, the photoresist is unchanged.

在掩模阻挡光地方，光刻胶没有变化。

Once again, we wash away remaining photoresist.

我们再次洗掉光刻胶。

Once more, we apply a photoresist, and use a new photomask to etch little channels.

再一次，我们应用光刻胶，并使用新光掩模蚀刻小通道。

The process essentially starts again, first by building up a fresh oxide layer ...which we coat in photoresist.

这个过程基本上又开始了，首先是建立一个新氧化层… … 我们在上面涂上光刻胶。

So, very similar to before, we apply a photoresist, use a photomask, dissolve the exposed resist, and use a chemical to remove any exposed metal.

因此，与之前非常相似， 我们应用光刻胶， 使用光掩模， 溶解暴露抗蚀剂，并使用化学去除任何暴露金属。

But where the light does hit the photoresist it changes chemically which lets us wash away only the photoresist that was exposed to light, selectively revealing areas of our oxide layer.

但是，在光确实照射到光刻胶地方，它会发生化学变化，这让我们只能洗掉暴露在光下光刻胶，有选择地露出氧化层区域。