Then, a liquid called " photoresist" is spun on and baked to harden.

接着，一种名为“刻胶”的液体被均匀涂抹并烘烤硬化。

In the lit areas, a reaction weakens the photoresist's chemical bonds.

照区域，反应削弱刻胶的化学键。

Next, using UV light and a stencil, a pattern is applied to the photoresist.

接下来，使用紫外线和模板，上施加图案。

The wafer is then sent through a hard bake to harden the remaining photoresist.

然后将硅片送入高温烘烤工，以硬化剩余的刻胶。

Where the mask blocks the light, the photoresist is unchanged.

掩模挡线的地方，发生变化。

Photoresists aren’t very useful by themselves, but are super powerful when used in conjunction with a photomask.

自身并是非常有用，但与掩模结合使用时就变得非常强大。

Next, the wafer is sent to a photoresist stripper, where the mask layer is removed.

接下来，晶圆被送到剥离机，其中掩模层被去除。

The wafer is doused in another chemical to wash away that weakened photoresist, leaving an image of the mask.

晶圆被另一种化学物质冲洗， 以清除那层被削弱的，留下掩模的图像。

Note that the oxide layer under the photoresist is protected.

请注意，下的氧化层受到保护。

And new problems arise: today, PFAS-based photoresists are essential to make ever-smaller features.

新的问题出现了：如今，基于PFAS的刻胶对于制造越来越小的特征至关重要。

Next, photoresist is spread across the surface and the wafer is sent through a soft bake to remove the solvent.

接下来，表面涂上，然后将硅片送入低温烘焙以去除溶。

These tools include the photoresist spin coater, photolithography tool, developer, and photoresist stripper.

这些工具包括旋涂机、刻设备、显影和剥离。

To clean up, we use yet another special chemical that washes away any remaining photoresist.

为了清理，我们使用另一种特殊的化学物质来洗掉任何剩余的。

Wherever the light from the stencil touches the wafer, the photoresist is weakened.

无论模板上的线照射到硅片的哪个位置，都被削弱。

Once again, we wash away remaining photoresist.

再次，我们清除剩余的刻胶。