The invention relates to thermocuring isotropic conductive adhesive and a preparation method thereof.

本发明涉一种热固化各向同性导其制备方法。

Macroscopic deviations from isotropy occur due to bedding, schistosity and also sometimes fracturing.

与各向同性相差很大往往产生于层理，片理，某些候则由于断裂所造成。

It leads to one simple equation, which, in the isotropic case, is the bipotential equation .

因为它可以推出一个简单方程，在各向同性下，这个简单方程是一个双位势方程。

Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.

以环氧树脂为基体,间苯二胺和二氨基二苯甲烷低融点混合物为固化剂,铜粉为导填料,制备了热固化各向同性导。