Self-preparation polymerizable macromolecular surfactant HTP and acrylate monomer were used to prepare the amphiphilic polymer by soap-free microemulsion pentamer copolymerization.
The mechanical property and thermal stability of cured epoxy resin were closely related to the chemical structure of hydrogenated terpinene maleic anhydride.
Pei-Chi Chang, Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang, "A Study on the Adhesion Between EMC and IC Encapsulation Mold", Automation Conference, P180 (2003).
The influences of the arylated alkyl amine and conventional polyamide curing agent on the performance of light epoxy antistatic coatings were studied respectively.
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
Applying a photopolymer resin instead of thermopolymer resin as a bonding material,a rapid manufacturing of grinding wheel is realized on the basis of rapid prototyping.
Radioactive nuclides are solidified at crystal lattice as one part of crystalloid by zirconolite-rich synroc, which greatly enhances the long-term safety of radioactive waste disposing.
Using lead benzoxy as curing agent,cured epoxy resin was analyzed by means of IR spectrum and DSC curves.Lead benzoxy was considered to be catalytic curing agent.
A foamable phenolic resin was prepared,through addition,condensation,in the presence of alkali.The resin was foamed with surfactant, foamer,solidifying agent , then the foam phenolplast was given .
It was shown that the curing process of resoles, at first, proceeded by condensation reaction of methylol groups, and the formation of dimethylene ether linkage was predominant.