Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.
图5,高转移效率与孔比率及它对回流峰共影响。
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Secondly, there is the question whether the marginal efficiency of capital is some absolute quantity or a ratio.
其次,资本边际效率个绝对量个比率问题。
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