I don't know if we have enough solder to finish these circuit boards.

我们好像没有足够焊来焊住些电路板。

But that only measures the temperature at the surface of the solder, rather than throughout the material.

但只测量了焊表面的温度，而不是整个材的温度。

Oh, they went to the store to get solder, which is metal you melt to make science things.

他们出去买焊了，就是那种能用火熔化做科学东西的金属。

The boys had to drive all the way to San Bernardino for the solder and got a flat.

他们俩为了焊一路开到圣贝纳迪诺，结果在路上胎了。

How can you call yourself a scientist and run out of solder?

你怎么好意自称科学家 结果没焊？

That makes sense. Do you think the solder we're using could be a problem?

：是有道理的。您认为我们使用的焊会有问题吗？

If the actual temperatures deviate from these ranges, it can cause incomplete solder fusion, leading to weak joints.

如果实际温度偏离些范围，可能会导致焊熔合不完全，从而导致接头脆弱。

Clogged nozzles can cause uneven solder flow, and an improper wave height can result in insufficient or excessive soldering.

堵塞的喷嘴会导致焊流动不均匀，而不适当的波高会导致焊接不足或过度。

If it's too high or too low, it can affect the solder deposition and joint formation.

如果它太高或太低， 都会影响焊沉积和焊缝形成。

Tin's comeback is thanks in part to a European Union regulation that banned lead in solder, meaning tin became ubiquitous in electronic circuits.

锡的卷土重来部分归功于欧盟禁止焊中使用铅的法规，意味着锡在电子电路中变得无处不在。

Also important would be to store food and drink in preferably glass containers, certainly to not store food in tins that can have solder inside them containing lead.

同样重要的是，将食物和饮存放在首选的玻璃容器中，绝对不要将食物存放在可能含有含铅焊的锡罐内。

10. Question: Name one advantage of using lead - free solder in PCBA. Answer: It is more environmentally friendly as it reduces the release of toxic lead into the environment.

10. 问题：说出在 PCBA 中使用无铅焊的一个优点。： 它更环保，因为它减少了有毒铅释放到环境中。

21. Question: What is the purpose of a solder mask in PCBA? Answer: It prevents solder from bridging between pads, protects the PCB from environmental factors, and helps in component identification.

21. 问题： PCBA 阻焊层的用途是什么？案： 它可以防止焊在焊盘之间架桥，保护 PCB 免受环境因素的影响，并有助于识别元件。

72. Question: How can we reduce the risk of solder spatter during the soldering process in PCBA? Answer: By controlling the solder volume, using proper soldering techniques, and adjusting the soldering temperature and time.

72. 问题：如何降低 PCBA 焊接过程中出现焊飞溅的风险？： 通过控制焊量，使用适当的焊接技术，并调整焊接温度和时间。

56. Question: In PCBA, how can we prevent solder wicking? Answer: By controlling the solder volume, optimizing the component lead length, and adjusting the soldering temperature and time to avoid excessive solder climbing up the leads.

56. 问题：在 PCBA 中，我们如何防止芯吸？案： 通过控制焊量，优化元件引线长度，调整焊接温度和时间，以避免过多的焊爬上引线。

51. Question: How does the cleanliness of the PCB surface impact the soldering process in PCBA? Answer: A dirty PCB surface can prevent proper wetting of the solder, leading to poor solder joints, increased resistance, and possible electrical failures.

51. 问题：PCB 表面的清洁度如何影响 PCBA 中的焊接过程？案： 肮脏的 PCB 表面会妨碍焊的适当润湿，从而导致焊点不良、电阻增加和可能的电气故障。