To do this, Microsoft had to add a new chip component.

为此，微软必须添加一个新片组件。

It's the newest version of Google's custom chip set.

这是谷歌定制片组最新版本。

Here's a diagram illustrating how the CPU and chipset are connected to everything else.

这里有一个示意图，说明了中央处理器和片组是如何连接到其他所有件。

Apple says it'll be almost 40% more powerful than the A13 chipset in iPhone 11 range.

苹果表示，它将比 iPhone 11 系列中 A13 片组强大近 40%。

The phone comes with new camera innovations, including enhanced computational photography, with the A15 chipset.

这款手机用 A15 片组， 带来了新相机创新， 包括增强计算摄影。

We worked with a chipset from CSR, a British company known for advanced Bluetooth audio technology.

我们使用了来自CSR这家英国公片组，该公以其先进蓝牙音频技术而闻名。

The chipset delivers 60% better performance than the prior iPad Air's A14 chipset.

该片组性能比之前 iPad Air A14 片组高出 60%。

The chipset for the phone was specifically chosen to give better AI performance at the cost of a better CPU.

该手机片组特意选用了以牺牲更优CPU性能为代价来提升AI性能配置。

The company is bringing its M1 chipset to the iPad Air, which is the same chip on the iPad Pro.

该公将其 M1 片组用于 iPad Air， 这与 iPad Pro 上片相同。

Local governments have focused their investments on low-end chip components in an effort to easily win market share, notes an industry insider.

一位业内消息人士指出，地方政府将投资重点放在低端片组件上，试图轻松赢得市场份额。

The iPhone 12 is powered by the A14 Bionic chipset – that's a chipset we've already seen confirmed for the iPad Air 4, and it's the world's first 5nm chipset.

iPhone 12 由 A14 Bionic 片组提供支持——这是我们已经确认用于 iPad Air 4 片组， 它是世界上第一个 5nm 片组。

Apple's latest iPhone SE takes the power of the same A15 Bionic chipset that's found on the flagship iPhone 13 series to give the company's compact and most affordable handset serious performance.

Apple 最新 iPhone SE 用了与旗舰 iPhone 13 系列相同 A15 仿生片组，为该公紧凑型和最实惠手机提供了强大性能。

Nothing went with a Snapdragon 778 processor for the phone, which surprised a lot of us who were expecting the company to use a current flagship chip set, like the Eight Gen One.

手机 Snapdragon 778 处理器没有任何问题，这让我们很多人感到惊讶，他们期待该公使用当前旗舰片组，比如第八代第一代。

HPE prefers something known as a dragonfly topology, a two-layer system in which groups of chips are connected to each other in clusters and those clusters are wired up to each other in turn.

惠普企业更倾向于使用一种称为“蜻蜓拓扑”结构，这是一种两层系统， 在该系统中， 片组相互连接形成集群， 而这些集群又彼此相连。