Find failure root cause by performing component eletrical and physical failure analysis, such like curve tracing, SAM, decapsulation, cross section, SEM etc.
半导体器件进行电性及物理失效分析,
如电性曲线分析,超声波扫描,开盖,断面,电子扫描显微等,找出失效的
正原因。
Find failure root cause by performing component eletrical and physical failure analysis, such like curve tracing, SAM, decapsulation, cross section, SEM etc.
半导体器件进行电性及物理失效分析,
如电性曲线分析,超声波扫描,开盖,断面,电子扫描显微等,找出失效的
正原因。
Ascites has been reported after kidney transplantation due to rejection, decapsulation of the graft, urinary or vascular leak, lymphocele, transudation, or infection.
肾移植后腹水的原因可能有排斥反应、移植肾包膜的剥脱、尿瘘或脉管瘘、淋巴囊肿、渗出物或感染。
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