A numerical model of polymer debinding in PIM is proposed, the stress distribution in the greenware is analyzed and the process parameters is discussed.
建立PIM脂过程中高分子高温裂解数学模型,分析生坯中应力分布,并讨论热脂工艺参数。
A numerical model of polymer debinding in PIM is proposed, the stress distribution in the greenware is analyzed and the process parameters is discussed.
建立PIM脂过程中高分子高温裂解数学模型,分析生坯中应力分布,并讨论热脂工艺参数。
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