In the production process of PCB, there are many defects such as surface smudginess, solder mask unevenness, text excursion, pad damage, track damage etc.
在印刷电路板的
过程
,
外观不整洁、阻焊不均匀、文字偏移、线路及焊盘破
等缺陷。
In the production process of PCB, there are many defects such as surface smudginess, solder mask unevenness, text excursion, pad damage, track damage etc.
在印刷电路板的过程,外观不整洁、阻焊不均匀、文字偏移、线路及焊盘破等缺陷。
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，部分未经过人工审核，其表达内容亦不代表本软件的观点；若发现问题，欢迎向我们指正。
