Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.
图5，锡高转移的效率与孔
率及它对回流峰共度的影响。
Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.
图5，锡高转移的效率与孔率及它对回流峰共度的影响。
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