Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.
图5,锡高转移的

孔面积比
及它对回流峰共面度的影响。
Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.
图5,锡高转移的

孔面积比
及它对回流峰共面度的影响。
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