bonds

This glue makes a good firm bond.

这种胶水粘得很结实。

The bonds are redeemable by annual drawings.

公债每年抽签偿还。

This new glue makes a firmer bond.

新胶水粘得牢。

Or they can buy unsell (and sell) existing bonds.

他们也可以买卖现有的债券。

Compared with diolefine rubber,EPDM has less double bond.

与二烯烃橡胶相比,EPDM的双键很少。

The peptide bond is the same as the imido bond of biuret.

处于等电点状态的蛋白质加热时凝固最完全、最迅速。

This glue is our new product and makes a firmer bond.

"这种胶水是我们的新产品,粘结力很强。"

This adhesive must be applied to both surfaces which are to be bonded together.

要粘接的个面都必须涂上这种黏剂。

The relationship between bond valence and bond covalency has been investigated by a semiempirical method.

用一种半经验方法研究了固体材料中键电荷与键共价性的关系。

All perpends are to be strictly true and square and the whole properly bonded together.

所有直角处必须精确和方正，且整体要粘妥当。

You need a strong adhesive to bond wood to metal.

需要强力胶才能把木料粘在金属上。

The whisky was taken to bonded warehouses at Port Dundee.

威士忌酒已送到邓迪港的保稅仓库。

We entered into a solemn bond.

我们缔结了一份正式约。

Fabrics are produced by bonding yarns together in terms of weaving or knitting, lacemaking, braiding or felting.

在网状结构以及处理、乾、热定形等装订设备的辅助下，非编织布料也可被使用。

The composition of butadiene polyperoxide is analyzed.The energy of explosion reactions is calculated by bond energy method.

分析了丁二烯聚过氧化物的成,用键能法计算了爆炸反应能量,结果与实例相符。

Grinding paper with self bonding nappa base (for fixinf on cloth ) with grain P40 up to P100.

研磨的编织abrasive (sand) complect:1. 以寛115毫米的氯丁(二烯)橡胶为底的织物粘贴在工具上.Cloth 2.P40Z至P100的砂纸粘贴再皮革上.

The great viscosimetry onusseit, its solid water with high, in the small, cohesion, bond strength can vary widely.

粘度大的胶粘剂，其固体含里高，水分少，内聚力大，粘结强度也大。

The resultant ionized bond can be cleaved by a hemi-heterolysis process, affording a cation and a neutral radical.

生成的离子化键能由半异裂的过程而开裂，提供一个正离子和一个中性的游离基。

Hydrolysis of glycosidic bond at C20 and isomerous reaction of C20 were the main reaction of dammarane type ginsenoside.

在加工过程中达玛烷型人参皂苷主要发生20位糖苷键水解和异构化。

The same forces and mechanisms responsible for size enlargement in roller compaction are responsible for bond formation during tabletting.

碾压中施加于颗粒增大的力和机理也用于压片的粘成型。