The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.
由于微型封装器件上的焊料球质量较小,加上封装体较薄,热量传送通过器件速度很快。
The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.
由于微型封装器件上的焊料球质量较小,加上封装体较薄,热量传送通过器件速度很快。
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