phenylenediamine

Novel controlled releasing polythiourea microcapsules were prepared from terephthaloyl diisothiocyanate and o-phenylenediamine by interfacial polycondensation.

以对苯甲酰异硫氰酸酯和邻苯原料通过界面缩聚法合成了聚硫脲缓释微胶囊。

Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.

以环氧树脂基体,间苯和氨基苯甲烷的低融点混合物剂,铜粉导电填料,制备了各向同性导电胶。