The process calculations such as layout chart of punching die for locatized plate, punching pressure, pressural center and etc.
分析了接线片特点和冲压工艺性,介绍了零件排样设计方案、模具及主要特点。
The process calculations such as layout chart of punching die for locatized plate, punching pressure, pressural center and etc.
分析了接线片特点和冲压工艺性,介绍了零件排样设计方案、模具及主要特点。
And then, the detail of designing process for the optic fiber pressural liquid level sensor is given in the thesis, including calculation of diaphragm and the microdeformation tooth plate.
并以为依据,设计了一套压力式光纤微弯液位传感系统。
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