A blowhole will form as a result of an out-gasing of a void in the BGA sphere during the reflow process.


过程中,因BGA锡球内孔隙有气体溢出而
成吹孔.
;回流
接A blowhole will form as a result of an out-gasing of a void in the BGA sphere during the reflow process.


过程中,因BGA锡球内孔隙有气体溢出而
成吹孔.
声明:以上例句、词性分类均由

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