A blowhole will form as a result of an out-gasing of a void in the BGA sphere during the reflow process.
在迴焊过程中,因BGA锡球内
隙有气体
.
A blowhole will form as a result of an out-gasing of a void in the BGA sphere during the reflow process.
在迴焊过程中,因BGA锡球内隙有气体.
声明：以上例句、词性分类均由互联网资源自动生
，部分未经过人工审核，其表达内容亦不代表本软件的观点；若发现问题，欢迎向我们指正。
