retral

The relative displacement between the front and retral loading location is emphasized.

着重研究了前后载点的相对位移。

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的方法对特基器件后部封装中的压焊工艺进行了参设计。