I endeavoured to unhasp the casement,but the hook was soldered into the staple.
我试着去打开那窗子,但窗钩给
在钩环里了。
料,

接,
合
接合;钎
接头
膏;
膏
,

;钎料

;

;

接掩模;
接淹模
;
条,
料;软
料I endeavoured to unhasp the casement,but the hook was soldered into the staple.
我试着去打开那窗子,但窗钩给
在钩环里了。
Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.
图5,
高转移的效率与孔面积比率及它对回流峰共面度的影响。
The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.
由于微型封装器件上的
料
质量较小,加上封装体较薄,热量传送通过器件速度很快。
In the production process of PCB, there are many defects such as surface smudginess, solder mask unevenness, text excursion, pad damage, track damage etc.
在印刷电路板的生产过程中,会产生外观不整洁、阻
不均匀、文字偏移、线路及
盘破损等缺陷。
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