unevenness

In the production process of PCB, there are many defects such as surface smudginess, solder mask unevenness, text excursion, pad damage, track damage etc.

在印刷电路板的产过程中,会产外观整洁、阻焊、文字偏移、线路及焊盘破损等缺陷。

Depth of field: with prqactices diode system (IDS), high-capacity ensures that the depth of field in the production of reliable. Autocompensation printing plate surface unevenness.

有了智能化的二极管系统（IDS），高景深的能力保证了产的可靠进行。自动补偿印版表面的度。