diaminodiphenylmethane

Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.

以环氧树脂基体,间二胺和二氨基二的低融点混合物固化剂,铜粉填料,制备了热固化各向同胶。