Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂
基体,间苯二胺和二氨基二苯甲烷的
混合物固
剂,铜粉导电填料,制备了热固
同性导电胶。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂基体,间苯二胺和二氨基二苯甲烷的混合物固剂,铜粉导电填料,制备了热固同性导电胶。
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；若发现问题，欢迎
我们指正。
