学术

The UIE hold a large scale international academical congress at intervals of four years.

摘要国际电热协会(UIE)每隔4年举行一次大规模国际性电热会议。

The aim of a university should be the advancement of learning.

大目标应是促进。

This is a book that displays the considerable scholarship of its author.

这是一本表现作者重大成就书。

He has gained a distinction in various fields of scholarly studies.

他在多种科研究中享有盛名。

Her academic qualifications are by the by. What we need is someone dynamic and creative.

她资历倒是次要,我们需要一个有活力、有创造力人。

Their writings took powerful hold of academic circles.

他们著作在界有巨大影响力。

There is a need for academic rigor in approaching this problem.

处理这个问题需要上严谨。

There was a careful avoidance of the sensitive topic in the scholastic circles.

界小心地避开那个敏感话题。

Creative Commons has moved from a fringy academic discussion to a boardroom discussion.

“创新性共享”已经从边缘性研讨延伸到董事会了。

I do not claim any scholarly disinterest with this book.

我并不要求对这本书有任何上公。

There is always a lot of back-stabbing in academic life.

界总是有许多冷枪暗箭。

She affiliates with an academic society.

她是某团体成员。

The issue centers around academic freedom.

争论围绕自由问题展开。

His lecture is intended to bear down on the application of acupuncture anaesthesia in brain surgery.

他报告打算重点谈针刺麻醉在脑外科方面应用。

Paper presented at workshop on Building Territories in the Interethnic Relationships in South-East Asia and South China.

发表于「区域社会与文化类型」国际研讨会。

The academic connotation includes successivity of history, originality of thoughts, integrity of system, and science and technology related.

内涵包括历史传承性、思路独创性、系统完整性和科技性四个方面。

A scholastic work is to have a useful bibliography at the end of each chapter or the whole book.

著作应该在每一章或全书之后附有一份参考书目。

Im)Patient Messianism: Marx, Levinas and Derrida.” The Second Annual Conference of the North American Levinas Society. Indianapolis: Purdue University.

论典范不可共量性：孔恩与卡维尔〉。「文艺典范与创意研发研讨会」。成功大文院。

Books have a centuries-old tradition of annotation and commentary, ranging from the Talmud and scholarly criticism to book clubs and marginalia.

从犹太法典与考证到书籍俱乐部和页边旁注，几个世纪以来，人们一直有给书做评论和注解习惯。

Pei-Chi Chang, Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang, "A Study on the Adhesion Between EMC and IC Encapsulation Mold", Automation Conference, P180 (2003).

张祥杰,黄圣杰,李辉煌,黄登渊,“电子构装材料之压力体积温度及固化反应之研究”中国工程师会第20届全国趼讨会论文集,(2003).