镀锡

1.Nickel underplating prevents the migration between tin or gold platings and the base material.

垫板镀镍可防止在镀或金层与基的移动。

2.Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.

主要论述印制线路板生产中所用的氟硼酸盐镀铅溶液。

3.The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

镀板金层是镀后在加热熔融处理过程中通过热扩散在基板与层生成的一种金属化物,,金层的生成与原板和镀层都有很大关系。