镀锡

Nickel underplating prevents the migration between tin or gold platings and the base material.

镍可防止在或金层与基料之间的移动。

Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.

主要论述印制线路生产中所用的氟硼酸盐铅溶液。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

合金层是后在加热熔融处理过程中通过热扩散在基与层之间生成的一种金属间化合物,因此,合金层的生成与原和层都有关系。