镀锡的

Nickel underplating prevents the migration between tin or gold platings and the base material.

垫板镀镍可防止在镀或金层与基料之间的移动。

Mainly discuss fluorborate terne electroplating solution in use for PCB fabrication.

主要论述印制线路板生产所用的氟硼酸盐镀。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

镀板合金层是镀后在加热熔融处理通热扩散在基板与层之间生成的一种金属间化合物,因此,合金层的生成与原板和镀层都有很大关系。